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Definition of "Die Bonding" |
The process of mounting a semiconductor chip [Semiconductor Die] to a package, a substrate or chip carrier. Also termed Wire Bonding which refers directly to bonding a lead wire to a semiconductor chip [see graphic]. A related page, for additional reference, covering PCB Terms and Definitions. / Die bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages. / A switch that has a definitive change in pressure or bump as you press it. This bump may coincide with or approximate the actuation point of the key. |
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