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Definition of "DIP IC" |
Dual Inline Package IC. A style of Integrated Circuit that has its pins on either side of a rectangular shaped package. Normally a DIP IC refers to a through-hole component, while a surface mound device would be called an SOIC [for example]. Refer to the topic covering DIP ICs and Sockets for a graphic and additional info. Also used to refer to a particular body width or pin row width that is associated with a few of the more common DIP IC packages, when used to refer to a DIP switch for example. Commonly found DIP packages that conform to JEDEC standards use an inter-lead spacing (lead pitch) of 0.1 inch (2.54 mm). Row spacing [associated with body width] varies depending on lead counts, with 0.3 in. (7.62 mm) or 0.6 inch (15.24 mm) the most common. |
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