Users Also Read
MCQ's Search Engine
Electrical Engineering
Mechanical Engineering
Civil Engineering
Automobile Engineering
Chemical Engineering
Computer Engineering
Electronics Engineering
Medical Science Engg
All Engineering Dictionary Terms
Definition of "TSSOP" |
Thin shrink small-outline package / Thin shrink small-outline package, / A Thin shrink small outline package is a rectangular, thin body size component. A Type I Thin shrink small outline package has legs protruding from the width portion of the package. A Type II Thin shrink small outline package has the legs protruding from the length portion of the package. A Thin shrink small outline package leg count can range from 8 to 64. Thin shrink small outline packages are particularly suited for gate drivers, controllers, wireless / RF, op-amps, logic, analog, ASICs, memory (EPROM, E2PROM), comparators and optoelectronics. Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging. |
Please type any word or choose alphabet below... |
A
B
C
D
E
F
G
H
I
J
K
L
M N O P Q R S T U V W X Y Z 1 2 3 4 5 6 7 8 9 0 |