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Definition of "channel-to-case thermal resistance" |
the proportionality constant (denoted θcc) at thermal equilibrium between the temperature difference of the FET channel (Tchannel) and a specified case surface (Tcase) to the dissipated power in the channel (Pw), in units of °C/W. The specified surface is usually the most effective in reducing the temperature. It includes the thermal resistance of the chip, die attach material (solder or adhesive), packaging and mounting medium, as applicable. |
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